Search
Last Update January.30, 2012 Current total about 20450 papers
Please push the "search" button after inputting keywords, such as a paper title, an author name, a journal, and the year of issue.
Example of key words
3D packaging
- Structure: density, integration, multilayer (multi-layer), multipin (multi-pin), 3D, small, thin, etc.
- Function: speed, power, reliability, mobile, EMI, EMC, thermal, etc.
- Component: CSP, BGA, bump, junction, joint, interposer, build-up, etc.
- Material: leadfree (lead-free), ACF, encapsulation, underfill, dielectric, etc.
- Technology: SMT, flipchip (flip-chip), flip, KGD, KGT, inspection, SIP, SOP, etc.
Optical packaging
- Structure: density, integration, multilayer (multi-layer), small, etc.
- Function: speed, power, channel, loss, cost, etc.
- Component: mirror, lens, connector, MCM, switch, laser, etc.
- Materital: polymer, fiber, waveguide, POF, etc.
- Technology: WDM, SMT, etc.
You can search also from a paper name, an author name, a reference name, an outline, and the year of issue, besides the above-mentioned keyword.